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14th-17th April

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FR4  Data Sheet :-                                             STD PCB Material / laminate
 

Test/Specification

FR4 Laminate Typical Values

Thermal Stress, Solder bath 288 deg. C

>60

Dimensional Stability, E-2/150

<0.04% Warp/fill

<1.00% Bow/Twist

Flammability, Classification UL94

V0

Water Absorption E-1/105

0.10%

Peel Strength After Thermal Stress

11 lb./in After 10s/288 Deg. C

Flexural Strength

100,000 lbf/inČ Lengthwise

75,000 lbf/inČ Crosswise

Resistivity After Damp Heat Volume

10 ^8 M ohms cm

Resistivity After Damp Heat Surface

10 ^8 M ohms

Dielectric Breakdown. Parallel to laminate

>60KV

Dielectric Constant @ 1MHz

4.7

Dissipation Factor @ 1MHz

0.014

Q-Resonance @ 1 MHz

>75

Q-Resonance @ 50 MHz

>95

Arc Resistance

125 s

Glass Transition Temperature

135 Deg. C

Temperature Index

130 Deg. C

A Few Other Relevant Facts from other Sources

Specific Gravity

1.8-1.9

Rockwell Hardness (M scale)

110

Coefficient of Thermal Expansion

11 microns/m/Deg.C Lengthwise

15 microns/m/Deg.C Crosswise

Thermal Conductivity

2.2-2.5 cal/h. cm Deg C

 

BT Epoxy Data

FR4 Laminate

 

 
                          

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