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Test/Specification
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FR4 Laminate Typical Values
|
|
Thermal Stress, Solder bath 288 deg. C
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>60
|
|
Dimensional Stability, E-2/150
|
<0.04% Warp/fill
|
|
<1.00% Bow/Twist
|
|
Flammability, Classification UL94
|
V0
|
|
Water Absorption E-1/105
|
0.10%
|
|
Peel Strength After Thermal Stress
|
11 lb./in After 10s/288 Deg. C
|
|
Flexural Strength
|
100,000 lbf/inČ Lengthwise
|
|
75,000 lbf/inČ Crosswise
|
|
Resistivity After Damp Heat Volume
|
10 ^8 M ohms cm
|
|
Resistivity After Damp Heat Surface
|
10 ^8 M ohms
|
|
Dielectric Breakdown. Parallel to laminate
|
>60KV
|
|
Dielectric Constant @ 1MHz
|
4.7
|
|
Dissipation Factor @ 1MHz
|
0.014
|
|
Q-Resonance @ 1 MHz
|
>75
|
|
Q-Resonance @ 50 MHz
|
>95
|
|
Arc Resistance
|
125 s
|
|
Glass Transition Temperature
|
135 Deg. C
|
|
Temperature Index
|
130 Deg. C
|
|
A
Few Other Relevant Facts from other Sources
|
|
Specific Gravity
|
1.8-1.9
|
|
Rockwell Hardness (M scale)
|
110
|
|
Coefficient of Thermal Expansion
|
11 microns/m/Deg.C Lengthwise
|
|
15 microns/m/Deg.C Crosswise
|
|
Thermal Conductivity
|
2.2-2.5 cal/h. cm Deg C
|
