Cheap, easily recoverable etch used for
etching PTH circuit boards, also used as a micro etch (chemical sandpaper)
before plating processes. A straight mixture of Sulphuric and Peroxide
makes a very fast etchent, but sadly is unstable and not safe to use.
Additives are added such as Aryl Sulfonic acids to stabilize the peroxide
in solution, and even Phosphoric acid which helps to retain a cleaner tin
lead over the copper. Std Reaction is :-
Cu + H2O2
+ H2SO4 >>
Cu2SO4 + 2H2O
Copper can be recovered as copper sulphate by
cooling and crystallization, or as metallic copper by electroplating. This
is often done by plating onto stainless steel plates using lead or
graphite anodes. After which the copper can be easily peeled off the
stainless steel plates.